Electronic material substrate "Alumina thick film printed substrate"
A high-reliability electronic material substrate with baked electrode materials and resistive materials.
The "Alumina Thick Film Circuit Board" is a high-reliability electronic material substrate that has excellent heat dissipation and heat resistance, with electrode materials and resistive materials baked onto an alumina substrate. Our company produces and sinters alumina substrates at our affiliated company, "Ina Ceramic Co., Ltd.," and has established a consistent high-quality line that includes circuit printing, sintering, resistance value adjustment, component mounting, molding, and electrical testing. It can be utilized in main applications such as automotive electronic components, communication industrial equipment, power supplies, and safety devices. 【Features of Alumina Substrate】 ■ Material: 96% Alumina ■ Color: White ■ Specific Gravity: 3.8±0.1 ■ Water Absorption (%): ≧0.1 ■ Flexural Strength (MPa): 215≦ ■ Hardness (GPa): 13.7±2.4 ■ Insulation Breakdown Voltage (V/mm): 1×10^7≦ *For more details, please refer to the PDF document or feel free to contact us.
- 企業：IAM Electronics Co., Ltd.
- 価格：Other
